Ioannis "John" Papapolymerou
Chairperson - Electrical and Computer Engineering (ECE)
Electrical and Computer Engineering (ECE), College of Engineering
MSU Foundation Professor - Electrical and Computer Engineering (ECE) in the College of Engineering
Engineering Bldg, 428 S Shaw Ln Room 2120B
Biography
John Papapolymerou's research interests are in the areas of RF/microwave/mm-wave/THz circuits, antennas and packaging for wireless communication systems, sensors and radars. His current projects include the utilization of additive manufacturing techniques for three-dimensional RF circuits and modules, the development of cost effective packaged RF modules for high power applications, as well as the ... development of thin nanomagnetic materials for high frequency applications. He served as the Editor-in-Chief for IEEE Microwave and Wireless Components Letters from 2012-2015.
Read MoreEducation
Ph.D. Electrical Engineering, University of Michigan, Ann Arbor, 1999
M.S. Electrical Engineering, University of Michigan, Ann Arbor, 1994
B.S. Electrical Engineering (Diploma) National Technical University of Athens, Greece 1993
Awards
H.A. Wheeler Prize Paper Award of the IEEE Antennas and Propagation Society, 2012
IEEE Fellow, 2011
IEEE AP-S John Kraus Antenna Award, 2010
IEEE MTT-S Outstanding Young Engineer Award, 2009
... Read MorePublications
D. Thompson, O. Tantot, H. Jallageas, G. Ponchak, M. Tentzeris and J. Papapolymerou, "Characterization of Liquid Crystal Polymer (LCP) Material and Transmission Lines on LCP Substrates From 30-110 GHz," IEEE Transactions on Microwave Theory and Techniques, Vol. 52, No. 4, pp. 1343-1352, April 2004.
C. Patterson, T. Thrivikraman, A. Yepes, S. Begley, S. Bhattacharya, J. Cressler and J. Papapolymerou, "A Lightweight Organic X-Band Phased Array with Integrated SiGe Amplifiers and Phase Shifters," IEEE Transactions on Antennas and Propagation, Vol. 59, No. 1, pp. 100-109, January 2011.
C. Donado Morcillo, C. Patterson, B. LaCroix, C. Coen, J.D. Cressler and J. Papapolymerou, "An Ultra-Thin, High-Power and Multilayer Organic Antenna Array with T/R Functionality in the X-Band," IEEE Transactions on Microwave Theory and Techniques, Vol. 50, No. 12-Part I, pp. 3856-3867, December 2012.
W.T. Khan, A. Vera, A.C. Ulusoy, and J. Papapolymerou, "Packaging a W-Band Integrated Module with an Optimized Flip-Chip Interconnect on an Organic Substrate," IEEE Transactions on Microwave Theory and Techniques, Vol. 62, No. 1, pp. 64-72, January 2014.
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