Co-packaged optical transceivers for HPC, data center and AI applications
Abstract
This talk will cover the status of fiber optic transceiver co-packaging efforts, both VCSEL- and SiPh-based, where they fit into the Ethernet switch market and the evolving Computer IO market, and how these technologies are advancing HPC (High Performance Computing), Data Center, and AI applications. The emphasis will be on new requirements and challenges driven by AI systems.
Bio
Daniel M. Kuchta (IEEE Fellow 2019) is a Principal Hardware System Architect at NVIDIA. Previously, he was a Research Staff Member in the Communications and Computation Subsystems Department at the IBM Thomas J. Watson Research Center beginning in 1992. He received B.S., M.S., and Ph.D. degrees in Electrical Engineering and Computer Science from the University of California, Berkeley, in 1986, 1988, and 1992, respectively. While at IBM Research, he worked on high-speed VCSEL characterization, multimode fiber links, parallel fiber optic links, and optics co-packaging technology research. He received the IEEE Journal of Lightwave Technology Best Paper Award in 2014 and, in 2018, was the first recipient of the IEEE Photonics Technology Letters Best Paper Award. He was Technical Program Chair for OFC 2018 and General Chair for OFC 2020. Dr. Kuchta is an author or co-author of more than 145 technical papers and an inventor or co-inventor of at least 40 patents.
Faculty Host: Thomas Clark
Zoom Meeting ID: 984 1645 2394
Passcode: eceseminar